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1-390261-2
| Manufacturer | |
| Description | Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET VERT 8POS TIN 8 way Augat tin plate DIL socket,0.3in IC & Component Sockets 8P ECONOMY TIN Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 8Row-to-Row Spacing = 7.62 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, SOCKET IC, DIL, 0.3", 8WAY DIP SOCKET, 8POS, THROUGH HOLE DIPSocket,8Position,VerticalMount,LadderFrame,.100CL,Thru-Hole TE Connectivity 垂直 2.54mm 节距 8 路, 通孔 模压引脚 封闭式框架 DIL 插座, 1A |
| Category |
Business
| Product | DIP / SIP Sockets | Product Category | IC & Component Sockets |
| Standard Package | Bulk | Factory Pack Quantity | 60 |
Compliance
| RoHS | Lead free / RoHS Compliant | EU RoHS | Compliant |
| Tariff No | 85369010 | Rad Hardened | No |
| Leadfree Defin | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c | RoHSELV Compliance | RoHS compliant, ELV compliant |
Electrical
| Voltage Rating | 250 V ac | Contact Resistance | 30 |
| Current Rating (Max) | 1A | Insulation Resistance | 10,000 |
| Voltage - Input (Min) | 250VAC | Connector - Voltage Input | :DIP |
Mechanical
| Depth | 10mm | Pitch | 2.54 mm |
| Width | 5.1mm | Height | 5.1 mm |
| Length | 10.16mm | Weight | 0.01 |
| Base Type | Ladder Frame | Packaging | Tube |
| Row Spacing | 7.62mm | Shell Style | Ladder |
| Termination | Solder | Contact Type | Dual Leaf |
| Lead Spacing | :2.54mm | Pitch - Post | 7.62 [0.300] |
| Mounting Type | Through Hole | Connector Type | :DIP |
| Contact Finish | Tin Over Nickel | Mounting Style | Vertical |
| Number of Rows | 2 | Package / Case | DIP |
| Insertion Force | 300g | Profile (W x H) | Standard |
| Contact Material | Phosphor Bronze | Housing Material | Polybutylene Terephthalate |
| Length - Overall | 10.16 mm | Package Quantity | Tube |
| Size / Dimension | 10.16 x 5.1 x 10mm | Termination Style | Solder Tail |
| Height Above Board | 5.10 [0.200] | Number of Contacts | 8 |
| Contact Termination | :Through Hole Vertical | Insulation Material | Polybutylene Terephthalate |
| Number of Positions | 8 | Center Contact Material | 2.54 [0.100] |
| Termination Post Length | 3.00 [0.118] | Contact Finish Thickness | 60µin (1.52µm) |
| 1st Connector Mounting Type | :PC Board | Number of Positions or Pins (Grid) | 8 (2 x 4) |
Product Info
| Type | DIP Socket | Gender | SKT |
| Series | :- | Features | Open Frame |
| CAD Drawing | 3D CAD Model | Product Type | DIP Socket |
| Other Specifications | Straight | ||
Environmental
| Temperature Range | -40 â +105 | Operating Temperature | +105°C |
Documents & Media
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Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET VERT 8POS TIN 8 way Augat tin plate DIL socket,0.3in IC & Component Sockets 8P ECONOMY TIN Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 8Row-to-Row Spacing = 7.62 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, SOCKET IC, DIL, 0.3", 8WAY DIP SOCKET, 8POS, THROUGH HOLE DIPSocket,8Position,VerticalMount,LadderFrame,.100CL,Thru-Hole TE Connectivity 垂直 2.54mm 节距 8 路, 通孔 模压引脚 封闭式框架 DIL 插座, 1A
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