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658-60ABT3
| Manufacturer | |
| Description | Heat Sinks 28mm OMNIDIRECTIONAL HEATSINK CPU 28MM SQ BLK W/TAPE Heat Sink Passive BGA Pin Array Adhesive Black Anodized Heatsink;Omnidirectional;15.2mm;BlackAnodized;withTape |
| Category |
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Business
| Product | Heat Sinks | Lead Time | 56 Days |
| Subcategory | Heat Sink | Product Category | Heat Sinks |
| Standard Package | 1 | Factory Pack Quantity | 1000 |
Compliance
| RoHS | RoHS Compliant | ||
Mechanical
| Color | Black | Shape | Square, Pin Fins |
| Width | 27.9 mm | Finish | BlackAnodized |
| Height | 15.24 mm | Length | 27.9 mm |
| Weight | 14.17g | Material | Aluminum |
| Fin Height | Omnidirectional Pin | Mounting Type | Omnidirectional |
| Mounting Style | SMD/SMT | Package / Case | BGA |
| Package Cooled | BGA | Material Finish | Black Anodized |
| Primary Material | BGAs/PowerPC? | Size / Dimension | 1.1Sq.in. |
| Attachment Method | Thermal Tape, Adhesive (Included) | Heat Sink Material | Aluminum |
| Height Above Board | 0.6in. | Height - Seated (Max) | 0.598" (15.20mm) |
Product Info
| Type | Top Mount | Features | OmnidirectionalFinPin |
| Application | BGA, Super BGA, PBGA, FPBGA, PowerPC | Configuration | Omnidirectional |
| Application Specifics | IntegratedCircuits | ||
Environmental
| Power Dissipation @ Temperature Rise | 2.5W @ 30°C | Thermal Resistance @ Forced Air Flow | 2.0°C/W @ 500 LFM |
Documents & Media
PDF Document
PDF Document
PDF Document
PDF Document