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658-60AB
| Manufacturer | |
| Description | Heat Sinks 28mm OMNIDIRECTIONAL HEATSINK CPU 28MM SQ BLK W/OTAPE Heat Sink Passive BGA Pin Array Adhesive Black Anodized HEAT SINK Heatsink;Omnidirectional;15.2mm;BlackAnodized |
| Category |
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Business
| Product | Heat Sinks | Lead Time | 56 Days |
| Subcategory | Heat Sink | Product Category | Heat Sinks |
| Standard Package | 1 | Factory Pack Quantity | 1000 |
Compliance
| RoHS | RoHS Compliant | Tariff No | 84879090 |
Mechanical
| Color | Black | Shape | Square, Pin Fins |
| Width | 27.9 mm | Finish | BlackAnodized |
| Height | 15.24 mm | Length | 27.9 mm |
| Weight | 0 | Material | Aluminum |
| Fin Height | Omnidirectional Pin | Mounting Type | Omnidirectional |
| Mounting Style | SMD/SMT | Package / Case | BGA |
| Package Cooled | BGA | Width (Inches) | :1.098" |
| Height (Inches) | :0.6" | Material Finish | Black Anodized |
| Width - Overall | :27.9mm | Length - Overall | :1.098" |
| Primary Material | BGAs/PowerPC? | Size / Dimension | 1.1Sq.in. |
| Attachment Method | Thermal Tape, Adhesive (Not Included) | Heat Sink Material | Aluminum |
| Height Above Board | 0.6in. | Height - Seated (Max) | 0.598" (15.20mm) |
| Shell Size - Insert (Convert From) | :15.24mm | ||
Product Info
| Type | Top Mount | Features | OmnidirectionalFinPin |
| Application | BGA, Super BGA, PBGA, FPBGA, PowerPC | Configuration | Omnidirectional |
| Application Specifics | IntegratedCircuits | ||
Environmental
| Thermal Resistance | :- | Power Dissipation @ Temperature Rise | 2.5W @ 30°C |
| Thermal Resistance @ Forced Air Flow | 2.0°C/W @ 500 LFM | ||
Documents & Media
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PDF Document
PDF Document