点击放大查看
651-B
| Manufacturer | |
| Description | Heat Sinks 14-16 PIN DIP BLK HEATSINK 14-16PIN DIP BLK Heat Sink Passive BGA Parallel Array Wing Adhesive Aluminum Black Anodized HEAT SINK Heatsink;6.1mm;BlackAnodized;Adhesive |
| Category |
对参数有疑问？问 AI 助手
Business
| Product | Heat Sinks | Lead Time | 56 Days |
| Subcategory | Heat Sink | Product Category | Heat Sinks |
| Standard Package | 1 | ||
Compliance
| RoHS | RoHS Compliant | Tariff No | 85411000 |
Mechanical
| Color | Black | Shape | Rectangular |
| Width | 10.54 mm | Finish | BlackAnodized |
| Height | 6.1 mm | Length | 19.05 mm |
| Weight | 0.00204 | Material | Aluminum |
| Mounting Type | SurfaceMount | Mounting Style | Adhesive |
| Package / Case | DIP-16 | Package Cooled | 14-DIP and 16-DIP |
| Width (Inches) | :0.413" | Height (Inches) | :0.24" |
| Material Finish | Black Anodized | Width - Overall | :10.5mm |
| Length - Overall | :0.752" | Primary Material | 14-16PinDIP/SRAM |
| Size / Dimension | 0.75×0.415x0.24in. | Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Heat Sink Material | Aluminum | Height - Seated (Max) | 0.240" (6.10mm) |
| Shell Size - Insert (Convert From) | :6.1mm | ||
Product Info
| Type | Top Mount | Features | ExtrudedHeatSink,UnidirectionalFinforBGAs |
| Application | DIP-14, DIP-16 | Configuration | SurfaceMount |
| Industry Aliases | 651B | Application Specifics | Microprocessors,ASICs |
Environmental
| Thermal Resistance | :- | Power Dissipation @ Temperature Rise | 0.5W @ 40°C |
| Thermal Resistance @ Forced Air Flow | 40°C/W @ 300 LFM | ||
Documents & Media
PDF Document
PDF Document
PDF Document