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628-40AB
| Manufacturer | |
| Description | Heat Sinks 43mm SQ BLK H=.4 HEATSINK CPU 43MM SQ BLK H=.4" Heat Sink Passive BGA Pin Array Adhesive Black Anodized Heatsink;45mmBGA;BlackAnodized;0.4in.Height |
| Category |
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Business
| Product | Heat Sinks | Lead Time | 56 Days |
| Subcategory | Heat Sink | Product Category | Heat Sinks |
| Standard Package | 1 | ||
Compliance
| RoHS | RoHS Compliant | ||
Mechanical
| Color | Black | Shape | Square, Pin Fins |
| Width | 43.2 mm | Finish | BlackAnodized |
| Height | 10.2 mm | Length | 44.45 mm |
| Weight | 25.51g | Material | Aluminum |
| Fin Height | Omnidirectional Pin | Mounting Type | Omnidirectional |
| Mounting Style | Screw | Package / Case | BGA |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | Material Finish | Black Anodized |
| Primary Material | BGAs | Size / Dimension | 1.75x1.7in. |
| Attachment Method | Thermal Tape, Adhesive (Not Included) | Heat Sink Material | Aluminum |
| Height Above Board | 0.4in. | Height - Seated (Max) | 0.400" (10.16mm) |
Product Info
| Type | Top Mount | Series | 628 |
| Features | OmnidirectionalFinPin | Application | BGA, Super BGA, PBGA, FPBGA |
| Configuration | Omnidirectional | Connection Type | Thermal Tape, Adhesive (Not Included) |
| Application Specifics | IntegratedCircuits | ||
Environmental
| Power Dissipation @ Temperature Rise | 2.5W @ 30°C | Thermal Resistance @ Forced Air Flow | 4°C/W @ 300 LFM |
Documents & Media
PDF Document
PDF Document