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| Manufacturer | |
| Description | Heat Sinks TO-3/DO-5 LO-PROFILE HEATSINK POWER NO MNT HOLES BLK Heat Sink Passive TO-3/DO-5 Stud Mount Aluminum Alloy 0.7°C/W Black Anodized Heatsink;TO-3;58C@50W;2.625in.;0.7C/W;NoMountingHole |
| Category |
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Business
| Product | Heat Sinks | Lead Time | 21 Days |
| Subcategory | Heat Sink | Product Category | Heat Sinks |
| Standard Package | 1 | ||
Compliance
| RoHS | RoHS Compliant | ||
Mechanical
| Color | Black | Shape | Rectangular |
| Width | 120.7 mm | Finish | BlackAnodized |
| Height | 66.7 mm | Length | 76.2 mm |
| Weight | 285.77g | Material | Aluminum |
| Fin Height | Unidirectional Fin | Mounting Type | Vertical |
| Mounting Style | Screw | Package / Case | TO-3 |
| Package Cooled | TO-3, DO-5, Stud Mount | Material Finish | Black Anodized |
| Front Connection | 0.7°C/W@250LFM | Primary Material | TO-3/DO-5/Stud-Mount |
| Size / Dimension | 4.75×2.625in. | Attachment Method | Press Fit |
| Heat Sink Material | Aluminum | Height - Seated (Max) | 2.625" (66.67mm) |
Product Info
| Type | Board Level | Series | 421 |
| Features | ExtrudedHeatSink,Double-Surface | Application | TO-3, DO-5, Stud Mounted Semiconductor Cases |
| Configuration | SurfaceMount | Bus Connection | 58°C@50W |
| Connection Type | Press Fit | Application Specifics | PowerSemiconductors |
Environmental
| Thermal Resistance | 0.7°C/W | Thermal Resistance @ Natural | 1.16°C/W |
| Power Dissipation @ Temperature Rise | 50W @ 58°C | Thermal Resistance @ Forced Air Flow | 0.7°C/W @ 250 LFM |
Documents & Media
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