BCN318SB332J7LF
| Manufacturer | |
| Description | Res Thick Film Array 3.3K Ohm 5% 0.5W �200ppm/�C BUS Molded 10-Pin 2512(8 X 1206) Convex SMD Embossed T/R |
| Category |
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Compliance
| Rad Hardened | No | Military Standard | Not Required |
Electrical
| Tolerance | 5% | Resistance | 3300 ohm |
| Power - Rated | 1/2 W | Circuit Pattern | BUS |
| Power - Peak Pulse | 1/16 W | Number of Resistors | 8 |
Mechanical
| Depth | 3.1 mm | Height | 0.55 mm |
| Packaging | Tape and Reel | Pitch - Post | 1.27 mm |
| Mounting Style | Surface Mount | Package / Case | 2512 |
| Length - Overall | 6.4 mm | Termination Style | Convex |
| Number of Positions | 10 | ||
Product Info
| Type | Array | Technology | Thick Film |
| Failure Rate | Not Required | ||
Environmental
| Operating Temperature | -55C to 125C | Temperature Coefficient | �200 ppm/�C |