HSB11-252518
| Manufacturer | |
| Description | HEAT SINK, BGA, 25 X 25 X 18 MM |
| Category |
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Compliance
| Part Status | Active | ||
Mechanical
| Shape | Square, Pin Fins | Width | 0.984" (25.00mm) |
| Length | 0.984" (25.00mm) | Diameter | - |
| Material | Aluminum Alloy | Packaging | Box |
| Fin Height | 0.709" (18.00mm) | Package Cooled | BGA |
| Material Finish | Black Anodized | Attachment Method | Adhesive (Not Included) |
Product Info
| Mfr | Same Sky (Formerly CUI Devices) | Type | Top Mount |
| Series | HSB | ||
Environmental
| Thermal Resistance @ Natural | 13.70°C/W | Power Dissipation @ Temperature Rise | 5.5W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 4.50°C/W @ 200 LFM | ||