HSB09-212115
| Manufacturer | |
| Description | HEAT SINK, BGA, 21 X 21 X 15 MM |
| Category |
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Compliance
| Part Status | Active | ||
Mechanical
| Shape | Square, Pin Fins | Width | 0.827" (21.00mm) |
| Length | 0.827" (21.00mm) | Diameter | - |
| Material | Aluminum Alloy | Packaging | Box |
| Fin Height | 0.591" (15.00mm) | Package Cooled | BGA |
| Material Finish | Black Anodized | Attachment Method | Adhesive (Not Included) |
Product Info
| Mfr | Same Sky (Formerly CUI Devices) | Type | Top Mount |
| Series | HSB | ||
Environmental
| Thermal Resistance @ Natural | 17.39°C/W | Power Dissipation @ Temperature Rise | 4.3W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 200 LFM | ||