HSB01-080808
| Manufacturer | |
| Description | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM |
| Category |
对参数有疑问？问 AI 助手
Compliance
| Part Status | Active | ||
Mechanical
| Shape | Square, Pin Fins | Width | 0.335" (8.50mm) |
| Length | 0.335" (8.50mm) | Diameter | - |
| Material | Aluminum Alloy | Packaging | Box |
| Fin Height | 0.315" (8.00mm) | Package Cooled | BGA |
| Material Finish | Black Anodized | Attachment Method | Adhesive (Not Included) |
Product Info
| Mfr | Same Sky (Formerly CUI Devices) | Type | Top Mount |
| Series | HSB | ||
Environmental
| Thermal Resistance @ Natural | 39.10°C/W | Power Dissipation @ Temperature Rise | 1.9W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 16.00°C/W @ 200 LFM | ||