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APF30-30-10CB
| Manufacturer | |
| Description | Heat Sinks 30x30x10mm HEATSINK LOW-PROFILE FORGED |
| Category |
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Business
| Product | Heat Sinks | Product Category | Heat Sinks |
| Standard Package | 100 | ||
Compliance
| RoHS | Lead free / RoHS Compliant | ||
Mechanical
| Color | Black | Shape | Square |
| Width | 30 mm | Height | 9.5 mm |
| Length | 30 mm | Material | Aluminum |
| Fin Height | Horizontal | Mounting Style | SMD/SMT |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | Material Finish | Black Anodized |
| Attachment Method | Thermal Tape, Adhesive (Not Included) | Height - Seated (Max) | 0.370" (9.40mm) |
Product Info
| Type | Top Mount | Application | BGA, PGA, PLCC, QFP |
Environmental
| Thermal Resistance | 3.25 C /W | Thermal Resistance @ Forced Air Flow | 3.3°C/W @ 200 LFM |
Documents & Media
PDF Document
PDF Document