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BDN16-3CB/A01

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BDN16-3CB/A01

Manufacturer
Description
Heat Sink Passive Pin Array Adhesive Tape 13.5°C/W Black Anodized HEATSINK CPU W/ADHESIVE 1.61"SQ
Category
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Business

Standard PackageBulk

Compliance

RoHSLead free / RoHS Compliant

Mechanical

ShapeSquare, Pin FinsWidth1.610" (40.89mm)
FinishBlack AnodizedHeight9.017 mm
Length1.610" (40.89mm)MaterialAluminum
Fin HeightPin ArrayPackage CooledAssorted (BGA, LGA, CPU, ASIC...)
Material FinishBlack AnodizedLength - Overall40.894 mm
Attachment MethodAdhesive TapeHeight - Seated (Max)0.355" (9.02mm)

Product Info

TypePassive

Environmental

Thermal Resistance13.5 °C/WThermal Resistance @ Natural13.5°C/W
Thermal Resistance @ Forced Air Flow4.5°C/W @ 400 LFM

Documents & Media

PDF Document