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BDN12-3CB/A01
| Manufacturer | |
| Description | Heat Sink Passive Pin Array Adhesive 19.6°C/W Black Anodized HEATSINK CPU W/ADHESIVE 1.21"SQ Heat Sink Passive Pin Array Adhesive 19.6C/W Black Anodized |
| Category |
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Business
| Standard Package | Bulk | ||
Compliance
| RoHS | Lead free / RoHS Compliant | EU RoHS | Compliant |
| Rad Hardened | No | ||
Mechanical
| Depth | 30.734 mm | Shape | Square, Pin Fins |
| Width | 1.210" (30.73mm) | Finish | Black Anodized |
| Height | 9.017 mm | Length | 1.210" (30.73mm) |
| Material | Aluminum | Fin Height | Pin Array |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) | Material Finish | Black Anodized |
| Length - Overall | 30.734 mm | Attachment Method | Adhesive Tape |
| Height - Seated (Max) | 0.355" (9.02mm) | ||
Product Info
| Type | Passive | DELETED | Compliant |
Environmental
| Thermal Resistance | 19.6 °C/W | Thermal Resistance @ Natural | 19.6°C/W |
| Thermal Resistance @ Forced Air Flow | 6.8°C/W @ 400 LFM | ||
Documents & Media
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