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HF115AC-0.0055-AC-105
| Manufacturer | |
| Description | THERM PAD SIP PKG W/ADH HI-FLOW |
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Business
| Standard Package | 100 | ||
Mechanical
| Color | Gray | Shape | Rectangular |
| Outline | 36.83mm x 21.29mm | Adhesive | Adhesive - One Side |
| Material | Phase Change Compound | Thickness | 0.0055" (0.140mm) |
Product Info
| Usage | SIP | Backing, Carrier | Fiberglass |
Environmental
| Thermal Resistivity | 0.35°C/W | Thermal Conductivity | 0.8 W/m-K |
Documents & Media
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