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573300D00010
| Manufacturer | |
| Description | Heat Sink Passive TO-263 SMD Heat Sinks SLV HEAT SINK TO-263 HEATSINK D-PAK .4" HIGH SMD |
| Category |
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Business
| Product | Heat Sinks | Lead Time | 84 Days |
| Subcategory | Heat Sink | Standard Package | Bulk |
| Factory Pack Quantity | 250 | ||
Compliance
| RoHS | No RoHS Version Available | EU RoHS | Not Compliant |
Mechanical
| Depth | 12.7 mm | Shape | Rectangular |
| Width | 26.16 mm | Height | 10.16 mm |
| Length | 12.7 mm | Material | Copper |
| Mounting Style | SMD/SMT | Package Cooled | TO-263 |
| Material Finish | Tin | Length - Overall | 26.16 mm |
| Attachment Method | SMD Pad | Heat Sink Material | Aluminum |
| Height - Seated (Max) | 0.400" (10.16mm) | ||
Product Info
| Type | Passive | Application | TO-263, Surface Mount |
| For Use With/Related Products | 573300D00010G | ||
Environmental
| Mechanical Life | Obsolete | Thermal Resistance | 18 C/W |
| Thermal Resistance @ Natural | 18°C/W | Power Dissipation @ Temperature Rise | 1.25W @ 30°C |
| Thermal Resistance @ Forced Air Flow | 10.0°C/W @ 200 LFM | ||