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mchp-SST12LF09
SST12LF09 RF Front End Series
The SST12LF09 RF Front End from Microchip Technology Inc. is a comprehensive solution designed for WLAN applications supporting 802.11b, g, n, and ac standards. This device integrates a power amplifier (PA), low noise amplifier (LNA), and single-pole triple-throw (SP3T) switch, all on a single chip, making it a versatile component for Wi-Fi front-end designs. If you're working on designing a Wi-Fi module for IoT devices, smartphones, or access points, this FEM (Front End Module) is a go-to choice. Its integrated PA ensures strong transmission capabilities, while the LNA boosts reception sensitivity, which is crucial for maintaining reliable communication in noisy environments. The SP3T switch offers flexibility in signal routing, allowing for efficient antenna switching between transmit and receive modes without the need for external components. One thing worth noting is that this module significantly reduces the bill of materials (BOM) by consolidating multiple components onto a single chip. Engineers tend to reach for this when they need a compact, high-performance solution that can handle the bandwidth and power requirements of modern WLAN standards without adding complexity to
The SST12LF09 RF Front End from Microchip Technology Inc. is a comprehensive solution designed for WLAN applications supporting 802.11b, g, n, and ac standards. This device integrates a power amplifier (PA), low noise amplifier (LNA), and single-pole triple-throw (SP3T) switch, all on a single chip, making it a versatile component for Wi-Fi front-end designs. If you're working on designing a Wi-Fi module for IoT devices, smartphones, or access points, this FEM (Front End Module) is a go-to choice. Its integrated PA ensures strong transmission capabilities, while the LNA boosts reception sensitivity, which is crucial for maintaining reliable communication in noisy environments. The SP3T switch offers flexibility in signal routing, allowing for efficient antenna switching between transmit and receive modes without the need for external components. One thing worth noting is that this module significantly reduces the bill of materials (BOM) by consolidating multiple components onto a single chip. Engineers tend to reach for this when they need a compact, high-performance solution that can handle the bandwidth and power requirements of modern WLAN standards without adding complexity to
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SST12LF09 RF Front End - Part List
1 parts in total| Mfr Part # | Quantity Available | Price | Category | MOQ | Unit Pack | Standard Package | RoHS | Frequency | Noise Figure | Data Rate (Max) | Current - Supply | Voltage - Supply | Bandwidth | Packaging | Mounting Style | Package / Case | Type | Series | Manufacturer | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SST12LF09-Q3CE Microchip Technology | 1868 | 5: $14.28 | - | 3000 | 3000 | 3,000 | Lead free / RoHS Compliant | 2.4 GHz to 2.5 GHz | 2.5 dB | 54 Mbps | 170 mA | 3.6 V | 40 MHz | Reel | SMD/SMT | X2QFN-16 | Front-End ICs | * | Microchip Technology | - 40 C |


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