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SMDLTLFP500 Series

The SMDLTLFP500 series from Chip Quik Inc. is a low-temperature solder paste designed for use in electronic assembly processes. This paste comes in convenient 500g jars, making it suitable for both small-scale prototyping and larger production runs. If you're working on projects that require precise temperature control during soldering, such as assembling components on thin PCBs or delicate substrates, this paste is an excellent choice. One thing worth noting is its lower melting point compared to traditional solder pastes, which can help reduce thermal stress on sensitive components and boards. Engineers tend to reach for this when they need to ensure reliable solder joints without damaging heat-sensitive materials. Another practical benefit is its long shelf life, which helps maintain consistent performance over extended periods. Overall, the SMDLTLFP500 series offers a versatile solution for those looking to improve the quality and reliability of their soldering processes while minimizing potential damage to their assemblies

The SMDLTLFP500 series from Chip Quik Inc. is a low-temperature solder paste designed for use in electronic assembly processes. This paste comes in convenient 500g jars, making it suitable for both small-scale prototyping and larger production runs. If you're working on projects that require precise temperature control during soldering, such as assembling components on thin PCBs or delicate substrates, this paste is an excellent choice. One thing worth noting is its lower melting point compared to traditional solder pastes, which can help reduce thermal stress on sensitive components and boards. Engineers tend to reach for this when they need to ensure reliable solder joints without damaging heat-sensitive materials. Another practical benefit is its long shelf life, which helps maintain consistent performance over extended periods. Overall, the SMDLTLFP500 series offers a versatile solution for those looking to improve the quality and reliability of their soldering processes while minimizing potential damage to their assemblies

Frequently Asked Questions

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SMDLTLFP500 - Part List

5 parts in total

Mesh Type

Type

Form

Mfr Part #Quantity AvailablePriceCategoryTypeFormSeriesProcessDiameterFlux TypeMesh TypePackagingShelf LifeWire GaugeCompositionPart StatusManufacturerMelting PointShipping InfoShelf Life StartBase Product NumberStorage/Refrigeration TemperatureProductRoHSDigi-Key Storage
SMDLTLFP500
SMDLTLFP500

Chip Quik

106: $867.00-Paste-----------------SolderRoHS Compliant-
SMDLTLFP500T3
SMDLTLFP500T3

Chip Quik Inc.

1020: $890.12-Solder PasteJar, 17.64 oz (500g)-Lead Free-No-Clean3Bulk6 Months-Bi57.6Sn42Ag0.4 (57.6/42/0.4)ActiveChip Quik Inc.281°F (138°C)Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.Date of ManufactureSMDLTL37°F ~ 46°F (3°C ~ 8°C)---
SMDLTLFP500T3C
SMDLTLFP500T3C

Chip Quik Inc.

101: $870.06-Solder PasteCartridge, 17.64 oz (500g)-Lead Free-No-Clean3Bulk6 Months-Bi57.6Sn42Ag0.4 (57.6/42/0.4)ActiveChip Quik Inc.281°F (138°C)Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.Date of ManufactureSMDLTL37°F ~ 46°F (3°C ~ 8°C)--Refrigerated
SMDLTLFP500T4C
SMDLTLFP500T4C

Chip Quik Inc.

1016: $1,099.56-Solder PasteCartridge, 17.64 oz (500g)-Lead Free-No-Clean4Bulk6 Months-Bi57.6Sn42Ag0.4 (57.6/42/0.4)ActiveChip Quik Inc.281°F (138°C)Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.Date of ManufactureSMDLTL37°F ~ 46°F (3°C ~ 8°C)---
SMDLTLFP500T5C
SMDLTLFP500T5C

Chip Quik Inc.

1012: $1,466.08-Solder PasteCartridge, 17.64 oz (500g)-Lead Free-No-Clean5Bulk6 Months-Bi57.6Sn42Ag0.4 (57.6/42/0.4)ActiveChip Quik Inc.281°F (138°C)Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.Date of ManufactureSMDLTL37°F ~ 46°F (3°C ~ 8°C)---
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