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HISDF9B interconnect Series
The HISDF9B interconnect series from Hirose Electric Co., Ltd., is a surface-mount board-to-board connector with a 1mm pitch. These connectors are designed for high-density applications where space is at a premium. If you're working on designs that require a compact form factor but still need robust connections, these connectors are a go-to choice. They offer reliable performance and easy assembly, making them ideal for PCB-to-PCB connections in a variety of electronic devices. One thing worth noting is their versatility; they can be found in everything from medical equipment to consumer electronics, where size and performance are critical factors. Engineers tend to reach for this series when they need a high-density solution that can handle frequent mating cycles without degradation. The 1mm pitch allows for dense routing and multiple signal paths, which is especially beneficial in today’s miniaturized devices. Additionally, the surface-mount design simplifies assembly processes and reduces the overall footprint, which is a significant advantage in modern electronics manufacturing
The HISDF9B interconnect series from Hirose Electric Co., Ltd., is a surface-mount board-to-board connector with a 1mm pitch. These connectors are designed for high-density applications where space is at a premium. If you're working on designs that require a compact form factor but still need robust connections, these connectors are a go-to choice. They offer reliable performance and easy assembly, making them ideal for PCB-to-PCB connections in a variety of electronic devices. One thing worth noting is their versatility; they can be found in everything from medical equipment to consumer electronics, where size and performance are critical factors. Engineers tend to reach for this series when they need a high-density solution that can handle frequent mating cycles without degradation. The 1mm pitch allows for dense routing and multiple signal paths, which is especially beneficial in today’s miniaturized devices. Additionally, the surface-mount design simplifies assembly processes and reduces the overall footprint, which is a significant advantage in modern electronics manufacturing
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HISDF9B interconnect - Part List
11 parts in total| Mfr Part # | Quantity Available | Price | Category | Pitch | Termination | Number of Contacts | Type | Gender | Number of Rows | Contact Finish |
|---|---|---|---|---|---|---|---|---|---|---|
HISDF9B9S1V69 hirose | 10 | 1000: $4.5846 | - | - | - | - | - | - | - | - |
HISDF9B09P1V69 hirose | 0 | - | 1 mm | Solder | 9 | Board to Board | HDR | - | - | |
HISDF9B19P1V69 hirose | 0 | - | - | - | - | - | - | - | - | |
HISDF9B51P1V69 hirose | 0 | - | 1 mm | Solder | 51 | Board to Board | HDR | 2 | Gold | |
HISDF9B41S1V32 hirose | 0 | - | 1 mm | Solder | 41 | Board to Board | RCP | 2 | - | |
HISDF9BA31P1V32 hirose | 0 | - | - | - | - | - | - | - | - | |
HISDF9B31P1V31 hirose | 0 | - | 1 mm | Solder | 31 | Board to Board | HDR | 2 | Gold | |
HISDF9B31P1V69 hirose | 0 | - | 1 mm | Solder | 31 | Board to Board | HDR | 2 | Gold | |
HISDF9B31S1V32 hirose | 0 | - | 1 mm | Solder | 31 | Board to Board | RCP | 2 | - | |
HISDF9B31P1V32 hirose | 0 | - | 1 mm | Solder | 31 | Board to Board | HDR | 2 | - | |
HISDF9B31S1V69 hirose | 0 | - | 1 mm | Solder | 31 | Board to Board | RCP | 2 | Gold |


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