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HISDF1230 interconnect Series
The HISDF1230 series from Hirose Electric is a surface-mount board-to-board connector designed for high-density interconnections with a 0.5mm pitch. These connectors are ideal for applications requiring compact PCB layouts, such as in consumer electronics, industrial control systems, and automotive electronics. The small footprint and high-density nature make them perfect for space-constrained designs where multiple signals need to be transferred between boards efficiently. One thing worth noting is that these connectors offer excellent signal integrity even at high frequencies, which is crucial in today’s fast-paced electronic devices. Engineers tend to reach for this series when they need reliable connections in tight spaces without compromising on performance. The surface-mount design simplifies assembly processes compared to through-hole options, making it a popular choice in modern PCB fabrication lines. Additionally, the 0.5mm pitch allows for a dense array of contacts, enabling the transfer of numerous signals or power rails in a small area, which is particularly beneficial in multi-layer PCB assemblies
The HISDF1230 series from Hirose Electric is a surface-mount board-to-board connector designed for high-density interconnections with a 0.5mm pitch. These connectors are ideal for applications requiring compact PCB layouts, such as in consumer electronics, industrial control systems, and automotive electronics. The small footprint and high-density nature make them perfect for space-constrained designs where multiple signals need to be transferred between boards efficiently. One thing worth noting is that these connectors offer excellent signal integrity even at high frequencies, which is crucial in today’s fast-paced electronic devices. Engineers tend to reach for this series when they need reliable connections in tight spaces without compromising on performance. The surface-mount design simplifies assembly processes compared to through-hole options, making it a popular choice in modern PCB fabrication lines. Additionally, the 0.5mm pitch allows for a dense array of contacts, enabling the transfer of numerous signals or power rails in a small area, which is particularly beneficial in multi-layer PCB assemblies
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HISDF1230 interconnect - Part List
15 parts in total| Mfr Part # | Quantity Available | Price | Category | Pitch | Termination | Contact Finish | Number of Rows | Number of Contacts | Type | Gender |
|---|---|---|---|---|---|---|---|---|---|---|
HISDF123040DP05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 40 | Board to Board | HDR | |
HISDF123020DP05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 20 | Board to Board | HDR | |
HISDF123036DP05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 36 | Board to Board | HDR | |
HISDF123010DS05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 10 | Board to Board | RCP | |
HISDF123080DP05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 80 | Board to Board | HDR | |
HISDF123060DP05V86 hirose | 0 | - | - | - | - | - | - | - | - | |
HISDF123040DS05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 40 | Board to Board | RCP | |
HISDF1230DS05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 30 | Board to Board | RCP | |
HISDF123050DS05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 50 | Board to Board | RCP | |
HISDF123050DP05V48 hirose | 0 | - | - | - | - | - | - | - | - | |
HISDF123050DP05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 50 | Board to Board | HDR | |
HISDF123060DS05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 60 | Board to Board | RCP | |
HISDF123020DS05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 20 | Board to Board | RCP | |
HISDF123030DS05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 30 | Board to Board | RCP | |
HISDF123080DS05V86 hirose | 0 | - | 0.5 mm | Solder | Gold | 2 | 80 | Board to Board | RCP |


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