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HISDF1230 interconnect Series

The HISDF1230 series from Hirose Electric is a surface-mount board-to-board connector designed for high-density interconnections with a 0.5mm pitch. These connectors are ideal for applications requiring compact PCB layouts, such as in consumer electronics, industrial control systems, and automotive electronics. The small footprint and high-density nature make them perfect for space-constrained designs where multiple signals need to be transferred between boards efficiently. One thing worth noting is that these connectors offer excellent signal integrity even at high frequencies, which is crucial in today’s fast-paced electronic devices. Engineers tend to reach for this series when they need reliable connections in tight spaces without compromising on performance. The surface-mount design simplifies assembly processes compared to through-hole options, making it a popular choice in modern PCB fabrication lines. Additionally, the 0.5mm pitch allows for a dense array of contacts, enabling the transfer of numerous signals or power rails in a small area, which is particularly beneficial in multi-layer PCB assemblies

The HISDF1230 series from Hirose Electric is a surface-mount board-to-board connector designed for high-density interconnections with a 0.5mm pitch. These connectors are ideal for applications requiring compact PCB layouts, such as in consumer electronics, industrial control systems, and automotive electronics. The small footprint and high-density nature make them perfect for space-constrained designs where multiple signals need to be transferred between boards efficiently. One thing worth noting is that these connectors offer excellent signal integrity even at high frequencies, which is crucial in today’s fast-paced electronic devices. Engineers tend to reach for this series when they need reliable connections in tight spaces without compromising on performance. The surface-mount design simplifies assembly processes compared to through-hole options, making it a popular choice in modern PCB fabrication lines. Additionally, the 0.5mm pitch allows for a dense array of contacts, enabling the transfer of numerous signals or power rails in a small area, which is particularly beneficial in multi-layer PCB assemblies

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HISDF1230 interconnect - Part List

15 parts in total

Number of Contacts

Gender

Mfr Part #Quantity AvailablePriceCategoryPitchTerminationContact FinishNumber of RowsNumber of ContactsTypeGender
0-0.5 mmSolderGold240Board to BoardHDR
0-0.5 mmSolderGold220Board to BoardHDR
0-0.5 mmSolderGold236Board to BoardHDR
0-0.5 mmSolderGold210Board to BoardRCP
0-0.5 mmSolderGold280Board to BoardHDR
0--------
0-0.5 mmSolderGold240Board to BoardRCP
0-0.5 mmSolderGold230Board to BoardRCP
0-0.5 mmSolderGold250Board to BoardRCP
0--------
0-0.5 mmSolderGold250Board to BoardHDR
0-0.5 mmSolderGold260Board to BoardRCP
0-0.5 mmSolderGold220Board to BoardRCP
0-0.5 mmSolderGold230Board to BoardRCP
0-0.5 mmSolderGold280Board to BoardRCP
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