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3m- Power Management ICs

3M Company was founded in 1902 and is headquartered in Maplewood, Minnesota, USA, operating as a diversified global technology giant. The company's core business spans four major segments: Safety & Industrial, Transportation & Electronics, Health Care, and Consumer, with a strong emphasis on innovation and a vast product portfolio. Within the electronic components sector, 3M is not a semiconductor manufacturer but a critical supplier of advanced materials and interconnects. Key electronic product lines include 3M™ Textool™ test sockets and connectors, 3M™ Twin Ax high-speed cable assemblies, 3M™ electrically conductive adhesive transfer tapes, and 3M™ thermally conductive interface materials. Additionally, the company provides fluoropolymers like 3M™ Dyneon™ and optical films for semiconductor fabrication and display manufacturing. 3M leverages its expertise across 51 core technology platforms to deliver solutions that enhance electronic device performance in smartphones, data centers, automotive electronics, and aerospace. In the electronic materials market, 3M holds a leading position due to its technical advantages, quality, and close collaboration with OEMs. The company's produ

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Power Management ICs - 型号列表

3 parts in total

Series

Operating Temperature

Number of Positions or Pins (Grid)

Mfr Part #Quantity AvailablePriceSeriesOperating TemperaturePart StatusMaterial Flammability RatingContact ResistanceCurrent Rating (Amps)PackagingTerminationPitch - PostMounting TypePitch - MatingHousing MaterialContact Finish - PostContact Finish - MatingContact Material - PostTermination Post LengthContact Material - MatingContact Finish Thickness - PostContact Finish Thickness - MatingNumber of Positions or Pins (Grid)TypeFeaturesManufacturerRoHSTariff NoWeightMaterialColor - ConnectorsNumber of PositionsMaterial - InsulationAccessory TypeFor Use With/Related Products
3010: $7.438:8200 / 8300:-55°C---------------------RoHS Compliant Part853690100.002:Stainless Steel:Grey:50:Stainless Steel:Strain Relief8250 Series
-Textool™-55°C ~ 150°CObsoleteUL94 V-0-1 ABulkSolder0.100" (2.54mm)Through Hole0.100" (2.54mm)Polyethersulfone (PES)GoldGoldBeryllium Copper0.130" (3.30mm)Beryllium Copper30.0µin (0.76µm)30.0µin (0.76µm)144 (15 x 15)PGA, ZIF (ZIP)Closed Frame3M---------
-Textool™-55°C ~ 150°CObsoleteUL94 V-0-1 ABulkSolder0.100" (2.54mm)Through Hole0.100" (2.54mm)Polyethersulfone (PES)GoldGoldBeryllium Copper0.130" (3.30mm)Beryllium Copper30.0µin (0.76µm)30.0µin (0.76µm)108 (13 x 13)PGA, ZIF (ZIP)Closed Frame3M---------
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